Guangdong ChengYue and Guangzhou ChengYue to Exhibit Thermal Substrates, Aluminum Copper Clad Laminates and Heavy Copper PCB Solutions at Formnext Asia Shenzhen 2026
classification:Exhibit time:2026-06-23
Guangdong ChengYue New Materials and Guangzhou ChengYue Electronics will participate in Formnext Asia Shenzhen 2026, showcasing advanced thermal substrates, aluminum copper clad laminates (Aluminum CCL), PCB heat dissipation materials, and heavy copper PCB solutions. As professional manufacturers of thermal management PCB materials and high-power circuit boards, ChengYue provides reliable solutions for LED lighting, automotive electronics, energy storage, industrial control, and additive manufacturing applications.
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