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ChengYue Participates in HKPCA Seminar on Rigid-Flex PCB Applications in AI Robotics

classification：Activities time：2026-08-19
ChengYue New Materials will take part in HKPCA’s online webinar “Rigid‑Flex PCB Application and Future Development Trends in AI Robot Industry”. Hosted by HKPCA, this webinar shares industry insights on AI robot market evolution, Rigid‑Flex PCB practical scenarios, core technical challenges and future outlook for robotic electronics.
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