Walton Group visited Guangzhou ChengYue to discuss Copper Clad Laminate (CCL) requirements, PCB material solutions, quality standards, and potential cooperation for electronic manufacturing applications.
Read moreChengYue New Materials will take part in HKPCA’s online webinar “Rigid‑Flex PCB Application and Future Development Trends in AI Robot Industry”. Hosted by HKPCA, this webinar shares industry insights on AI robot market evolution, Rigid‑Flex PCB practical scenarios, core technical challenges and future outlook for robotic electronics.
Read moreChengYue will exhibit at Formnext Asia Shenzhen 2026, Booth D19, highlighting Aluminum PCB and Aluminum IMS solutions for 3D printer thermal management, including power control, motor drivers, heater control and high-power LED applications.
Read moreImran Muzaffar, CEO of Imran Brothers from Lahore, Pakistan, recently visited Guangzhou ChengYue for business discussions on PCB and IMS material cooperation. During the visit, both parties explored opportunities in Metal Core PCB manufacturing, thermal conductive IMS materials, and customized solutions for Pakistan’s growing LED, solar inverter, and industrial electronics markets. This meeting strengthens the partnership between China and Pakistan in the electronics supply chain and highlights Guangzhou ChengYue’s commitment to providing high-quality IMS PCB solutions for global customers.
Read moreGuangzhou ChengYue took part in the 21st Automotive Lighting Industry Development Technology Forum and Shanghai International Automotive Lighting Exhibition (ALE 2026), connecting with industry professionals and exploring the evolving requirements of automotive lighting and thermal management. The event highlighted opportunities for IMS, MCPCB and high thermal conductivity PCB technologies in automotive LED lighting, EV electronics and intelligent vehicle lighting applications.
Read moreAs a professional manufacturer of high-end metal-based CCL (aluminum/copper base) and epoxy CCL, Chengyue Electronics (Booth 7D16) showcased high thermal conductivity and high-reliability heat dissipation solutions.
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